256KB Flash HCS12 Microcontroller (MCU) featuring a 25 MHz maximum clock and CPU frequency. This surface-mount device utilizes a 112-pin LQFP package with a 0.65mm pin pitch, measuring 20mm x 20mm x 1.45mm. It offers 12KB of RAM and 91 programmable I/Os, operating within a -40°C to 85°C temperature range.
PackageLQFP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP MC9S12A256CCPVE technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 112 |
| PCB | 112 |
| Package Length (mm) | 20 |
| Package Width (mm) | 20 |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 1.2783 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFA |
| Maximum Clock Rate | 25MHz |
| Maximum CPU Frequency | 25MHz |
| Program Memory Type | Flash |
| Program Memory Size | 256KB |
| RAM Size | 12KB |
| Number of Programmable I/Os | 91 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MC9S12A256CCPVE Datasheet
Download the complete datasheet for NXP MC9S12A256CCPVE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.