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Technical Specifications
NXP MC9S12C64MFA technical specifications.
General
Access Time
25us
Package/Case
LQFP
Core Architecture
HCS12
Halogen Free
Not Halogen Free
Interface
SPI, CAN, SCI, EBI/EMI
Lead Free
Contains Lead
Max Operating Temperature
125°C
Memory Size
64KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
31
Oscillator Type
Internal
Packaging
Tray
Peripherals
POR, PWM, WDT
RAM Size
4096B
RoHS Compliant
No
Series
HCS12
Compliance
RoHS
Not Compliant
Datasheet
NXP MC9S12C64MFA Datasheet
Download the complete datasheet for NXP MC9S12C64MFA to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.