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Technical Specifications
NXP MC9S12DG256CCFU technical specifications.
General
| Access Time | 25us |
| Package/Case | QFP |
| Core Architecture | HCS12 |
| Interface | I2C, SPI, CAN, SCI |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Memory Size | 256KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 59 |
| Oscillator Type | Internal |
| Package Quantity | 84 |
| Packaging | Tray |
| Peripherals | PWM, WDT |
| RAM Size | 12288B |
| Series | HCS12 |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC9S12DG256CCFU Datasheet
Download the complete datasheet for NXP MC9S12DG256CCFU to view detailed technical specifications.
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