16-bit CISC microcontroller featuring HCS12 core architecture. 96KB Flash program memory and 6KB RAM. Operates at a maximum clock rate of 32 MHz. Equipped with 34 programmable I/Os, 10 ADC channels, and CAN/SCI/SPI interfaces. Packaged in a 48-pin QFN EP (Quad Flat No Lead Package, Exposed Pad) with a 0.5mm pin pitch, suitable for surface mounting. Designed for automotive applications with an operating temperature range of -40°C to 125°C.
PackageQFN EP
MountingSurface Mount
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Technical Specifications
NXP MC9S12P96MFTR technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
48
PCB
48
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-208KKEA
Family Name
HCS12
Data Bus Width
16bit
Instruction Set Architecture
CISC
Maximum Clock Rate
32MHz
Maximum CPU Frequency
32MHz
Device Core
HCS12
Program Memory Type
Flash
Program Memory Size
96KB
RAM Size
6KB
Number of Programmable I/Os
34
Core Architecture
HCS12
Programmability
Yes
Number of Timers
1
Interface Type
CAN/SCI/SPI
CAN
1
I2C
0
SPI
1
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
ADC Channels
10
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC9S12P96MFTR Datasheet
Download the complete datasheet for NXP MC9S12P96MFTR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.