16-bit RISC microcontroller featuring 1MB Flash program memory and 64KB RAM. This HCS12X family MCU operates at up to 50 MHz, offering 152 programmable I/Os and dual ADCs with 32 channels each. It supports CAN (5), I2C (2), and SPI (3) interfaces, with a maximum operating supply voltage range of 1.98V to 5.5V. Packaged in a 208-pin MAP-BGA with a 17mm x 17mm footprint, this surface-mount component is designed for automotive applications and operates from -40°C to 85°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MC9S12XEP100CVL technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
208
PCB
208
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.3(Max)
Seated Plane Height (mm)
2(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
HCS12X
Data Bus Width
16bit
Instruction Set Architecture
RISC
Maximum Clock Rate
50MHz
Maximum CPU Frequency
50MHz
Device Core
HCS12X
Program Memory Type
Flash
Program Memory Size
1MB
RAM Size
64KB
Number of Programmable I/Os
152
Core Architecture
HCS12X
Programmability
Yes
Number of Timers
1
Interface Type
CAN/I2C/SCI/SPI
CAN
5
I2C
2
SPI
3
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
1.98|2.9|5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
32/32
Number of ADCs
Dual
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC9S12XEP100CVL Datasheet
Download the complete datasheet for NXP MC9S12XEP100CVL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.