32-bit ColdFire RISC microcontroller featuring an 80 MHz maximum clock rate and 64KB Flash program memory. This surface-mount device utilizes a 10mm x 10mm MAP-BGA package with 81 pins and a 1mm pin pitch. It includes 16KB RAM, 56 programmable I/Os, and interfaces for I2C (2), SPI (1), and UART (2). Operating from a 3.3V supply, this microcontroller offers 8 ADC channels and operates within a temperature range of -40°C to 85°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF52100CVM80J technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 81 |
| PCB | 81 |
| Package Length (mm) | 10 |
| Package Width (mm) | 10 |
| Package Height (mm) | 1.12 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 0.2431 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | MCF5211x |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 80MHz |
| Maximum CPU Frequency | 80MHz |
| Device Core | ColdFire |
| Program Memory Type | Flash |
| Program Memory Size | 64KB |
| RAM Size | 16KB |
| Number of Programmable I/Os | 56 |
| Core Architecture | ColdFire |
| Programmability | Yes |
| Number of Timers | 1 |
| Interface Type | I2C/SPI/UART |
| CAN | 0 |
| I2C | 2 |
| SPI | 1 |
| Ethernet | 0 |
| UART | 2 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| ADC Channels | 8 |
| Number of ADCs | Single |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MCF52100CVM80J Datasheet
Download the complete datasheet for NXP MCF52100CVM80J to view detailed technical specifications.
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