32-bit RISC microcontroller featuring a ColdFire core, operating at up to 80 MHz. This MCU offers 128KB of Flash program memory and 16KB of RAM. It includes 56 programmable I/Os, multiple communication interfaces (2x I2C, 1x SPI, 3x UART), and 8 ADC channels. The component is housed in an 81-pin MAP-BGA package with a 10x10mm footprint, designed for surface mounting.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF52110CVM80J technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
81
PCB
81
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.12
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Weight (g)
0.2431
Package Material
Plastic
Mounting
Surface Mount
Family Name
MCF5211x
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
80MHz
Maximum CPU Frequency
80MHz
Device Core
ColdFire
Program Memory Type
Flash
Program Memory Size
128KB
RAM Size
16KB
Number of Programmable I/Os
56
Core Architecture
ColdFire
Programmability
Yes
Number of Timers
1
Interface Type
I2C/SPI/UART
CAN
0
I2C
2
SPI
1
Ethernet
0
UART
3
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
8
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCF52110CVM80J Datasheet
Download the complete datasheet for NXP MCF52110CVM80J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.