32-bit RISC microprocessor featuring a ColdFire core, operating at a maximum speed of 240 MHz with 16KB instruction and 16KB data cache. This surface-mount component utilizes a 0.13um process technology and is housed in a 256-pin MAP-BGA package measuring 17x17x1.16mm. Connectivity includes I2C, SPI, and UART interfaces, with three UART channels and one I2C channel available. It supports operating supply voltages from 1.65V to 3.6V and operates within a temperature range of 0°C to 70°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCF54451VM240J technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.16
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
1
Package Weight (g)
0.7748
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220VKKD-2
Family Name
ColdFire MCF5445X Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
ColdFire
Maximum Speed
240MHz
Process Technology
0.13um
Number of CPU Cores
1
Interface Type
I2C/SPI/SSI/UART
CAN
0
UART
3
USART
0
I2C
1
SPI
1
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.65|3.6V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Instruction Cache Size
16KB
Data Cache Size
16KB
Multiply Accumulate
Yes
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCF54451VM240J Datasheet
Download the complete datasheet for NXP MCF54451VM240J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.