Applications Processor System on Chip (SoC) featuring an ARM926EJ-S core operating at up to 400 MHz. This 32-bit device utilizes a 0.09um process technology and offers 128KB of RAM. The 400-pin MAP-BGA package, measuring 17x17x1.18mm with a 0.8mm pin pitch, supports surface mount installation. Integrated interfaces include Ethernet (MII/RMII, 10/100Mbps), I2C, I2S, SPI, UART, and USB, with a wide operating temperature range of -40°C to 85°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX253CJM4 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Lead Shape
Ball
Pin Count
400
PCB
400
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.18
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
i.MX25
Device Core
ARM926EJ-S
Maximum Clock Rate
400MHz
Program Memory Type
ROMLess
Data Bus Width
32bit
Maximum Speed
400MHz
Process Technology
0.09um
RAM Size
128KB
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.52V
Typical Operating Supply Voltage
1.45V
Number of Programmable I/Os
3
Application
Graphical Remote Controls/Handheld Scanners and Printers/Residential Gateway
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
Ethernet/I2C/I2S/SPI/SSI/UART/USB
SPI
2
I2C
3
I2S
2
UART
5
USB
2
USART
0
CAN
0
Ethernet
1
Number of Timers
5
Programmability
No
Core Architecture
ARM
Ethernet Interface Type
MII/RMII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCIMX253CJM4 Datasheet
Download the complete datasheet for NXP MCIMX253CJM4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.