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Technical Specifications
NXP MCIMX253CVM4 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Interface
I2C, SPI, USB, Ethernet, MMC, UART, USART, EBI/EMI, 1-WIRE
Max Operating Temperature
85°C
Memory Type
ROM, L1 Cache, External Program Memory,
Min Operating Temperature
-40°C
Number of I/Os
128
Operating Supply Voltage
1.52V
Oscillator Type
External
Package Quantity
90
Packaging
Tray
Peripherals
POR, PWM, WDT, DMA, LCD
RAM Size
128KB
RoHS Compliant
Yes
Series
i.MX25
Weight
0.02963oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX253CVM4 Datasheet
Download the complete datasheet for NXP MCIMX253CVM4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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