
Applications Processor, System on Chip (SoC) featuring an ARM926EJ-S core architecture. This 32-bit device operates at a maximum clock rate of 400 MHz, built on a 0.09um process technology. It offers 128KB of RAM and includes multiple interfaces such as Ethernet (MII/RMII, 10/100Mbps), I2C, I2S, SPI, UART, and USB. The component is housed in a 400-pin MAP-BGA package with a 0.8mm pin pitch, designed for surface mounting.
NXP MCIMX253DJM4 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Lead Shape | Ball |
| Pin Count | 400 |
| PCB | 400 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.18 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | i.MX25 |
| Device Core | ARM926EJ-S |
| Maximum Clock Rate | 400MHz |
| Program Memory Type | ROMLess |
| Data Bus Width | 32bit |
| Maximum Speed | 400MHz |
| Process Technology | 0.09um |
| RAM Size | 128KB |
| Type | Applications Processor |
| Processing Unit | Microprocessor |
| Max Operating Supply Voltage | 1.52V |
| Typical Operating Supply Voltage | 1.45V |
| Number of Programmable I/Os | 3 |
| Application | Graphical Remote Controls/Handheld Scanners and Printers/Residential Gateway |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 70°C |
| Interface Type | Ethernet/I2C/I2S/SPI/SSI/UART/USB |
| SPI | 2 |
| I2C | 3 |
| I2S | 2 |
| UART | 5 |
| USB | 2 |
| USART | 0 |
| CAN | 0 |
| Ethernet | 1 |
| Number of Timers | 5 |
| Programmability | No |
| Core Architecture | ARM |
| Ethernet Interface Type | MII/RMII |
| Ethernet Speed | 10Mbps/100Mbps |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP MCIMX253DJM4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.