400 MHz ARM926EJ-S Applications Processor SoC with 45KB RAM, built on 0.09um process technology. Features a 473-pin MAP-BGA package with 0.8mm pitch, measuring 19x19x1.12mm for surface mounting. Supports multimedia applications with interfaces including Ethernet (MII, 10/100Mbps), 3x SPI, 2x I2C, 6x UART, and 3x USB. Operates within a temperature range of -40°C to 85°C with a typical supply voltage of 1.45V.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX27MJP4A technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
473
PCB
473
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.12
Seated Plane Height (mm)
1.54(Max)
Pin Pitch (mm)
0.8
Package Weight (g)
0.9194
Package Material
Plastic
Mounting
Surface Mount
Family Name
i.MX21
Device Core
ARM926EJ-S
Maximum Clock Rate
400MHz
Program Memory Type
ROMLess
Maximum Speed
400MHz
Process Technology
0.09um
RAM Size
45KB
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.52V
Typical Operating Supply Voltage
1.45V
Application
Multimedia
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
Ethernet/I2C/SPI/UART/USB
SPI
3
I2C
2
I2S
0
UART
6
USB
3
USART
0
CAN
0
Ethernet
1
Programmability
No
Core Architecture
ARM
Ethernet Interface Type
MII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCIMX27MJP4A Datasheet
Download the complete datasheet for NXP MCIMX27MJP4A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.