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Technical Specifications
NXP MCIMX27MOP4AR2 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Halogen Free
Halogen Free
Max Operating Temperature
85°C
Memory Type
ROM, L1 Cache
Min Operating Temperature
-40°C
Min Supply Voltage
1.38V
Mount
Surface Mount
Number of Cores
1
Operating Supply Voltage
1.52V
Package Quantity
750
Packaging
Tape and Reel
Radiation Hardening
No
RoHS Compliant
Yes
Series
i.MX27
Weight
0.032431oz
Compliance
RoHS
Compliant
Datasheet
NXP MCIMX27MOP4AR2 Datasheet
Download the complete datasheet for NXP MCIMX27MOP4AR2 to view detailed technical specifications.
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