Applications Processor System on Chip (SoC) featuring an ARM1136JF-S core, operating at a maximum clock rate of 400 MHz. This 32-bit device utilizes 0.09um process technology and offers 16KB RAM and 32KB ROM. The 473-pin MAP-BGA package, measuring 19x19x1.2mm with a 0.8mm pin pitch, is designed for surface mounting. Integrated interfaces include I2C (3), I2S (1), SPI (3), UART (5), and USB (3), supporting multimedia applications within an automotive temperature range of -40°C to 85°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX31CJMN4C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Lead Shape
Ball
Pin Count
473
PCB
473
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.2(Max)
Seated Plane Height (mm)
1.54(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
i.MX31
Device Core
ARM1136JF-S
Maximum Clock Rate
400MHz
Program Memory Type
ROM
Data Bus Width
32bit
Maximum Speed
400MHz
Program Memory Size
32KB
Process Technology
0.09um
RAM Size
16KB
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.47V
Application
Multimedia
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
I2C/I2S/SPI/UART/USB
SPI
3
I2C
3
I2S
1
UART
5
USB
3
USART
0
CAN
0
Ethernet
0
Number of Timers
3
Programmability
Yes
Core Architecture
ARM
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCIMX31CJMN4C Datasheet
Download the complete datasheet for NXP MCIMX31CJMN4C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.