
Applications Processor System on Chip (SoC) featuring an ARM1136JF-S core, operating at a maximum clock rate of 400 MHz. This 32-bit device utilizes 0.09um process technology and offers 16KB RAM and 32KB ROM. The 473-pin MAP-BGA package, measuring 19x19x1.2mm with a 0.8mm pin pitch, is designed for surface mounting. Integrated interfaces include I2C (3), I2S (1), SPI (3), UART (5), and USB (3), supporting multimedia applications within an automotive temperature range of -40°C to 85°C.
NXP MCIMX31CJMN4C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Lead Shape | Ball |
| Pin Count | 473 |
| PCB | 473 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.2(Max) |
| Seated Plane Height (mm) | 1.54(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | i.MX31 |
| Device Core | ARM1136JF-S |
| Maximum Clock Rate | 400MHz |
| Program Memory Type | ROM |
| Data Bus Width | 32bit |
| Maximum Speed | 400MHz |
| Program Memory Size | 32KB |
| Process Technology | 0.09um |
| RAM Size | 16KB |
| Type | Applications Processor |
| Processing Unit | Microprocessor |
| Max Operating Supply Voltage | 1.47V |
| Application | Multimedia |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Interface Type | I2C/I2S/SPI/UART/USB |
| SPI | 3 |
| I2C | 3 |
| I2S | 1 |
| UART | 5 |
| USB | 3 |
| USART | 0 |
| CAN | 0 |
| Ethernet | 0 |
| Number of Timers | 3 |
| Programmability | Yes |
| Core Architecture | ARM |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP MCIMX31CJMN4C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.