400-pin MAP-BGA System on Chip (SoC) applications processor featuring an ARM1136JF-S core operating at up to 400 MHz. This 0.09um process technology device offers 128KB RAM and 32KB ROM, with a 32-bit data bus width. Designed for automotive infotainment and navigation, it supports multiple interfaces including CAN, Ethernet (MII, 10/100Mbps), I2C, I2S, SPI, UART, and USB. The surface-mount component has a 17mm x 17mm x 1.18mm plastic package with a 0.8mm pin pitch and operates within a -40°C to 85°C temperature range.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX355AJM4B technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
400
PCB
400
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.18
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
i.MX35
Device Core
ARM1136JF-S
Maximum Clock Rate
400MHz
Program Memory Type
ROM
Data Bus Width
32bit
Maximum Speed
400MHz
Program Memory Size
32KB
Process Technology
0.09um
RAM Size
128KB
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.47V
Application
Automotive Infotainment/Navigation
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
CAN/Ethernet/I2C/I2S/SPI/UART/USB
SPI
2
I2C
3
I2S
2
UART
2
USB
2
USART
0
CAN
2
Ethernet
1
Number of Timers
1
Programmability
Yes
Core Architecture
ARM
Ethernet Interface Type
MII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCIMX355AJM4B Datasheet
Download the complete datasheet for NXP MCIMX355AJM4B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.