Applications Processor System on Chip (SoC) featuring an ARM1136JF-S core operating at up to 400 MHz. This 0.09um process technology device offers 128KB RAM and 32KB ROM, with a 400-pin MAP-BGA package measuring 17x17x1.18mm. Designed for multimedia applications, it supports I2C, UART, and USB interfaces and operates within a -40°C to 85°C temperature range.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX357CJQ4C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 400 |
| PCB | 400 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.18 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | i.MX35 |
| Device Core | ARM1136JF-S |
| Maximum Clock Rate | 400MHz |
| Program Memory Type | ROM |
| Maximum Speed | 400MHz |
| Program Memory Size | 32KB |
| Process Technology | 0.09um |
| RAM Size | 128KB |
| Type | Applications Processor |
| Processing Unit | Microprocessor |
| Max Operating Supply Voltage | 1.47V |
| Application | Multimedia |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Interface Type | I2C/UART/USB |
| Number of Timers | 1 |
| Programmability | Yes |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
NXP MCIMX357CJQ4C Datasheet
Download the complete datasheet for NXP MCIMX357CJQ4C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.