Applications Processor System on Chip (SoC) featuring an ARM1136JF-S core operating at up to 400 MHz. This 0.09um process technology device offers 128KB RAM and 32KB ROM, with a 400-pin MAP-BGA package measuring 17x17x1.18mm. Designed for multimedia applications, it supports I2C, UART, and USB interfaces and operates within a -40°C to 85°C temperature range.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX357CJQ4C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
400
PCB
400
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.18
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
i.MX35
Device Core
ARM1136JF-S
Maximum Clock Rate
400MHz
Program Memory Type
ROM
Maximum Speed
400MHz
Program Memory Size
32KB
Process Technology
0.09um
RAM Size
128KB
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.47V
Application
Multimedia
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
I2C/UART/USB
Number of Timers
1
Programmability
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
NXP MCIMX357CJQ4C Datasheet
Download the complete datasheet for NXP MCIMX357CJQ4C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.