ARM Cortex A8 Applications Processor, 800 MHz maximum clock rate, 32-bit data bus width, and 128KB RAM. This System on Chip (SoC) features a 0.06um process technology and is housed in a 529-pin BGA package with a 0.8mm pin pitch. Designed for surface mounting, it operates within a temperature range of -20°C to 85°C and supports interfaces including Ethernet (MII, 10/100Mbps), I2C, SPI, UART, and USB.
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX513DJM8CR2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
529
PCB
529
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.12
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
i.MX51
Device Core
ARM Cortex A8
Maximum Clock Rate
800MHz
Program Memory Type
ROMLess
Data Bus Width
32bit
Maximum Speed
800MHz
Process Technology
0.06um
RAM Size
128KB
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.15V
Typical Operating Supply Voltage
1.1V
Application
Netbooks/Nettops/Mobile Internet Devices
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Interface Type
Ethernet/I2C/SPI/UART/USB
SPI
3
I2C
3
I2S
1
UART
4
USB
4
USART
0
CAN
0
Ethernet
1
Number of Timers
3
Programmability
No
Core Architecture
ARM
Ethernet Interface Type
MII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCIMX513DJM8CR2 Datasheet
Download the complete datasheet for NXP MCIMX513DJM8CR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.