32-bit ARM Cortex M4 RISC microcontroller featuring 512KB Flash program memory and 128KB RAM. This surface-mount device operates at up to 100 MHz and supports multiple interfaces including CAN, I2C, I2S, SPI, and UART. Packaged in a 121-pin MAP-BGA with a 0.65mm pitch, it offers 57 programmable I/Os and dual ADCs/DACs. Operating voltage ranges from 1.8V to 3.3V with a maximum of 3.6V, and it functions within an extended temperature range of -40°C to 105°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MK10DN512ZVMB10R technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
121
PCB
121
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.96
Seated Plane Height (mm)
1.3(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Family Name
K10
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
100MHz
Maximum CPU Frequency
100MHz
Device Core
ARM Cortex M4
Program Memory Type
Flash
Program Memory Size
512KB
RAM Size
128KB
Number of Programmable I/Os
57
Core Architecture
ARM
Programmability
Yes
Number of Timers
8
Interface Type
CAN/I2C/I2S/SPI/UART
CAN
2
I2C
2
SPI
3
Ethernet
0
UART
5
USART
0
USB
0
I2S
1
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Number of ADCs
Dual
Number of DACs
Dual
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MK10DN512ZVMB10R Datasheet
Download the complete datasheet for NXP MK10DN512ZVMB10R to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.