32-bit ARM Cortex M4 RISC microcontroller featuring 512KB Flash program memory and 64KB RAM. This surface-mount device operates at up to 50 MHz and offers 56 programmable I/Os. Connectivity includes I2C (2), SPI (1), UART (4), I2S (1), and USB (1) interfaces. The component is housed in a 121-pin MAP-BGA package with a 0.65mm pin pitch, measuring 8mm x 8mm x 1.27mm. Operating voltage ranges from 1.8V to 3.3V, with a maximum supply of 3.6V, and it functions within an extended temperature range of -40°C to 105°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MK22DN512VMC5 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
121
PCB
121
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
1.27(Max)
Seated Plane Height (mm)
1.52(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Family Name
K22
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
50MHz
Maximum CPU Frequency
50MHz
Device Core
ARM Cortex M4
Program Memory Type
Flash
Program Memory Size
512KB
RAM Size
64KB
Number of Programmable I/Os
56
Core Architecture
ARM
Programmability
Yes
Number of Timers
6
Interface Type
I2C/I2S/SPI/UART/USB
CAN
0
I2C
2
SPI
1
Ethernet
0
UART
4
USART
0
USB
1
I2S
1
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
ADC Channels
20
Number of ADCs
Single
DAC Channels
1
DAC Resolution
12bit
Number of DACs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MK22DN512VMC5 Datasheet
Download the complete datasheet for NXP MK22DN512VMC5 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.