32-bit ARM Cortex M4 RISC microcontroller featuring 256KB Flash program memory and 121-pin MAP-BGA package. Operates at up to 72 MHz with a 32-bit data bus and RISC instruction set. Includes 14 timers, dual ADCs, single DAC, and interfaces for CAN, I2C, I2S, SPI, and UART. Surface mountable with a 0.65mm pin pitch, this plastic BGA package measures 8x8x1.27mm. Supports operating voltages from 1.8V to 3.3V with a maximum of 3.6V and operates within a temperature range of -40°C to 105°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MK30DX256VML7 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
121
PCB
121
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
1.27(Max)
Seated Plane Height (mm)
1.52(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Family Name
K30
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
72MHz
Maximum CPU Frequency
72MHz
Device Core
ARM Cortex M4
Program Memory Type
Flash
Program Memory Size
256KB
RAM Size
128KB
Core Architecture
ARM
Programmability
Yes
Number of Timers
14
Interface Type
CAN/I2C/I2S/SPI/UART
CAN
1
I2C
2
SPI
3
Ethernet
0
UART
5
USART
0
USB
0
I2S
1
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Number of ADCs
Dual
Number of DACs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MK30DX256VML7 Datasheet
Download the complete datasheet for NXP MK30DX256VML7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.