32-bit ARM Cortex M4 RISC microcontroller featuring a 100 MHz clock rate and 256KB Flash program memory. This surface-mount device offers 64KB RAM, 100 programmable I/Os, and a 144-pin MAP-BGA package with a 1mm pitch. Integrated peripherals include CAN, Ethernet, I2C, I2S, SPI, UART, and USB interfaces. Operates across a wide temperature range of -40°C to 105°C with supply voltages from 1.8V to 3.6V. Includes dual ADCs with 42 channels and a single 12-bit DAC.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP MK60DN256VMD10 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
144
PCB
144
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
1.27(Max)
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
K60
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
100MHz
Maximum CPU Frequency
100MHz
Device Core
ARM Cortex M4
Program Memory Type
Flash
Program Memory Size
256KB
RAM Size
64KB
Number of Programmable I/Os
100
Core Architecture
ARM
Programmability
Yes
Number of Timers
9
Interface Type
CAN/Ethernet/I2C/I2S/SPI/UART/USB
CAN
2
I2C
2
SPI
3
Ethernet
1
UART
6
USART
0
USB
1
I2S
1
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
ADC Channels
42
Number of ADCs
Dual
DAC Channels
2
DAC Resolution
12bit
Number of DACs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MK60DN256VMD10 Datasheet
Download the complete datasheet for NXP MK60DN256VMD10 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.