32-bit ARM Cortex M4 RISC microcontroller featuring 1MB Flash program memory and 128KB RAM. This surface-mount device operates at a maximum clock rate of 120 MHz and offers 95 programmable I/Os. Connectivity includes CAN, Ethernet, I2C, I2S, SPI, UART, and USB interfaces. The 144-pin MAP-BGA package measures 13x13x1.27mm with a 1mm pin pitch. Operating voltage ranges from 1.8V to 3.6V, with an operating temperature range of -40°C to 105°C.
PackageMAP-BGA
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP MK61FN1M0VMD12 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
144
PCB
144
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
1.27(Max)
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
K61
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
120MHz
Maximum CPU Frequency
120MHz
Device Core
ARM Cortex M4
Program Memory Type
Flash
Program Memory Size
1MB
RAM Size
128KB
Number of Programmable I/Os
95
Core Architecture
ARM
Programmability
Yes
Number of Timers
8
Interface Type
CAN/Ethernet/I2C/I2S/SPI/UART/USB
CAN
2
I2C
2
SPI
3
Ethernet
1
UART
6
USART
0
USB
2
I2S
2
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
ADC Channels
53
Number of ADCs
Quad
DAC Channels
2
DAC Resolution
12bit
Number of DACs
Dual
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MK61FN1M0VMD12 Datasheet
Download the complete datasheet for NXP MK61FN1M0VMD12 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.