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Technical Specifications
NXP MM908E622ACPEK technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Halogen Free
Halogen Free
Interface
SPI, SCI
Max Operating Temperature
85°C
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
12
Package Quantity
26
Packaging
Rail/Tube
RoHS Compliant
Yes
Weight
0.029902oz
Compliance
RoHS
Compliant
Datasheet
NXP MM908E622ACPEK Datasheet
Download the complete datasheet for NXP MM908E622ACPEK to view detailed technical specifications.
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