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Technical Specifications
NXP MM912F634CV2AP technical specifications.
General
Package/Case
LQFP
Core Architecture
HCS12
Data Bus Width
16b
Interface
LIN, SCI
Max Frequency
16MHz
Max Operating Temperature
105°C
Memory Size
32KB
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
9
Operating Supply Voltage
27V
Package Quantity
250
Packaging
Tray
RAM Size
2KB
RoHS Compliant
Yes
Weight
0.006972oz
Compliance
RoHS
Compliant
Datasheet
NXP MM912F634CV2AP Datasheet
Download the complete datasheet for NXP MM912F634CV2AP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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