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Technical Specifications
NXP MMA1220KEGR2 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10.45(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 3.3(Max) |
| Seated Plane Height (mm) | 3.55(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 0.6092 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Axis Type | Single |
| Acceleration | ±8g |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| Device Sensitivity Range | 237.5mV/g to 262.5mV/g |
| Min Operating Supply Voltage | 4.75V |
| Typical Operating Supply Voltage | 5V |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MMA1220KEGR2 Datasheet
Download the complete datasheet for NXP MMA1220KEGR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.