PackageSOIC W
MountingSurface Mount
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Technical Specifications
NXP MMA6222KEG technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
12.95(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
3.3(Max)
Seated Plane Height (mm)
3.8(Max)
Pin Pitch (mm)
1.27
Package Weight (g)
0.7614
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AC
Axis Type
Dual
Acceleration
±20g
Max Operating Supply Voltage
3.45|5.25V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Min Operating Supply Voltage
3.15|4.75V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MMA6222KEG Datasheet
Download the complete datasheet for NXP MMA6222KEG to view detailed technical specifications.
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