PackageSOIC
MountingSurface Mount
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Technical Specifications
NXP MMA8210TEGR2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10.45(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
3.3(Max)
Seated Plane Height (mm)
3.55(Max)
Pin Pitch (mm)
1.27
Package Weight (g)
0.6092
Package Material
Plastic
Mounting
Surface Mount
Axis Type
Single
Acceleration
±50/±100g
Max Operating Supply Voltage
30V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Output Type
Digital
Min Operating Supply Voltage
6.3V
Typical Operating Supply Voltage
9|12|15|18|24V
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MMA8210TEGR2 Datasheet
Download the complete datasheet for NXP MMA8210TEGR2 to view detailed technical specifications.
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