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Technical Specifications
NXP MPC106ARX66CE technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CBGA
Package Description
Ceramic Ball Grid Array
Lead Shape
Ball
Pin Count
304
PCB
304
Package Length (mm)
25
Package Width (mm)
21
Package Height (mm)
2.17(Max)
Package Material
Ceramic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MPC106ARX66CE Datasheet
Download the complete datasheet for NXP MPC106ARX66CE to view detailed technical specifications.
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