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Technical Specifications
NXP MPC17511EPR2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
24
PCB
24
Package Length (mm)
4
Package Width (mm)
4
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Motor Driver
Min Operating Supply Voltage
2V
Max Operating Supply Voltage
6.8V
Min Operating Temperature
-20°C
Max Operating Temperature
65°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC17511EPR2 Datasheet
Download the complete datasheet for NXP MPC17511EPR2 to view detailed technical specifications.
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