32-bit RISC microcontroller featuring an e200 core and a maximum clock rate of 264 MHz. This surface-mount device offers 4MB of Flash program memory and 256KB of RAM. It supports CAN, SCI, and SPI interfaces, with 4 CAN and 4 SPI channels. Packaged in a 416-pin BGA with a 1mm pitch, this plastic ball grid array measures 27x27mm with a maximum height of 1.95mm. Operating voltage ranges from 3.3V to 5V, with an operating temperature range of -40°C to 125°C. Includes quad ADCs with 64 channels each.
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MPC5674FMVR264 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 416 |
| PCB | 416 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.95(Max) |
| Seated Plane Height (mm) | 2.55(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | MPC56xx |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 264MHz |
| Maximum CPU Frequency | 264MHz |
| Device Core | e200 |
| Program Memory Type | Flash |
| Program Memory Size | 4MB |
| RAM Size | 256KB |
| Core Architecture | e200 |
| Programmability | Yes |
| Number of Timers | 3 |
| Interface Type | CAN/SCI/SPI |
| CAN | 4 |
| I2C | 0 |
| SPI | 4 |
| Ethernet | 0 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 3.6|5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| ADC Channels | 64/64/64/64 |
| Number of ADCs | Quad |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MPC5674FMVR264 Datasheet
Download the complete datasheet for NXP MPC5674FMVR264 to view detailed technical specifications.
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