Frequency300MHz
PackageFCBGA
MountingSurface Mount
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Technical Specifications
NXP MPC755BPX300LE technical specifications.
General
Package/Case
FCBGA
Core Architecture
PowerPC
Data Bus Width
32b
Frequency
300MHz
Max Frequency
300MHz
Max Operating Temperature
105°C
Min Operating Temperature
0°C
Max Supply Voltage
2.1V
Min Supply Voltage
1.8V
Mount
Surface Mount
Number of Cores
1
Operating Supply Voltage
2V
Package Quantity
44
Packaging
Tray
Radiation Hardening
No
RoHS Compliant
No
Series
MPC7xx
Weight
0.087645oz
Compliance
RoHS
Not CompliantNo
Datasheet
NXP MPC755BPX300LE Datasheet
Download the complete datasheet for NXP MPC755BPX300LE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.