32-bit RISC microprocessor featuring a PowerQUICC II core operating at a maximum speed of 133 MHz. This surface-mount component utilizes a 0.29um process technology and offers 16KB instruction and 16KB data cache. It is housed in a 480-pin TBGA package with a 1.27mm pin pitch, measuring 37.5mm x 37.5mm x 1.05mm. Interface capabilities include I2C, SPI, and UART, with a maximum operating supply voltage of 1.9V and an operating temperature range of -40°C to 105°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8260CZU133 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
480
PCB
480
Package Length (mm)
37.5
Package Width (mm)
37.5
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-192BAT-1
Family Name
PowerQUICC II MPC82xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
PowerQUICC II
Maximum Speed
133MHz
Process Technology
0.29um
Number of CPU Cores
1
Interface Type
I2C/SPI/UART
Max Operating Supply Voltage
1.9V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Instruction Cache Size
16KB
Data Cache Size
16KB
Multiply Accumulate
No
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MPC8260CZU133 Datasheet
Download the complete datasheet for NXP MPC8260CZU133 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.