32-bit RISC microprocessor featuring a PowerQUICC II core operating at a maximum speed of 133 MHz. This surface-mount component utilizes a 0.29um process technology and offers 16KB instruction and 16KB data cache. It is housed in a 480-pin TBGA package with a 1.27mm pin pitch, measuring 37.5mm x 37.5mm x 1.05mm. Interface capabilities include I2C, SPI, and UART, with a maximum operating supply voltage of 1.9V and an operating temperature range of -40°C to 105°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8260CZU133 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 480 |
| PCB | 480 |
| Package Length (mm) | 37.5 |
| Package Width (mm) | 37.5 |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.7(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-192BAT-1 |
| Family Name | PowerQUICC II MPC82xx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | PowerQUICC II |
| Maximum Speed | 133MHz |
| Process Technology | 0.29um |
| Number of CPU Cores | 1 |
| Interface Type | I2C/SPI/UART |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| Instruction Cache Size | 16KB |
| Data Cache Size | 16KB |
| Multiply Accumulate | No |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP MPC8260CZU133 Datasheet
Download the complete datasheet for NXP MPC8260CZU133 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.