32-bit RISC microprocessor featuring a 603e core, operating at a maximum speed of 333 MHz with 0.13um process technology. This single-core MPU, part of the PowerQUICC II MPC82xx Processor family, is housed in a 480-pin TBGA package with a 1.27mm pin pitch. Designed for surface mount applications, it supports a maximum operating supply voltage of 1.6V and operates within a temperature range of -40°C to 105°C. The TBGA package measures 37.5mm x 37.5mm with a maximum height of 0.95mm.
PackageTBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8270CZUQLD technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
480
PCB
480
Package Length (mm)
37.5
Package Width (mm)
37.5
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Family Name
PowerQUICC II MPC82xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
603e
Maximum Speed
333MHz
Process Technology
0.13um
Number of CPU Cores
1
Max Operating Supply Voltage
1.6V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC8270CZUQLD Datasheet
Download the complete datasheet for NXP MPC8270CZUQLD to view detailed technical specifications.
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