32-bit RISC microprocessor featuring a 603e core, operating at a maximum speed of 333 MHz with 0.13um process technology. This single-core MPU, part of the PowerQUICC II MPC82xx Processor family, is housed in a 480-pin TBGA package with a 1.27mm pin pitch. Designed for surface mount applications, it supports a maximum operating supply voltage of 1.6V and operates within a temperature range of -40°C to 105°C. The TBGA package measures 37.5mm x 37.5mm with a maximum height of 0.95mm.
PackageTBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8270CZUQLD technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 480 |
| PCB | 480 |
| Package Length (mm) | 37.5 |
| Package Width (mm) | 37.5 |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | PowerQUICC II MPC82xx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | 603e |
| Maximum Speed | 333MHz |
| Process Technology | 0.13um |
| Number of CPU Cores | 1 |
| Max Operating Supply Voltage | 1.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MPC8270CZUQLD Datasheet
Download the complete datasheet for NXP MPC8270CZUQLD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.