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Technical Specifications
NXP MPC850DECZQ66BU technical specifications.
General
Package/Case
BGA
Data Bus Width
32b
Frequency
66MHz
Halogen Free
Not Halogen Free
Lead Free
Contains Lead
Max Frequency
66MHz
Max Operating Temperature
95°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.465V
Min Supply Voltage
3.135V
Mount
Surface Mount
Number of Cores
1
Operating Supply Voltage
3.3V
Package Quantity
60
Packaging
Tray
Radiation Hardening
No
RAM Size
8KB
RoHS Compliant
No
Series
MPC8xx
Weight
0.060814oz
Compliance
RoHS
Not CompliantNo
Datasheet
NXP MPC850DECZQ66BU Datasheet
Download the complete datasheet for NXP MPC850DECZQ66BU to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.