Frequency66MHz
PackageBGA
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Technical Specifications
NXP MPC850DEZQ66BUR2 technical specifications.
General
Package/Case
BGA
Data Bus Width
32b
Halogen Free
Not Halogen Free
Lead Free
Contains Lead
Max Frequency
66MHz
Max Operating Temperature
95°C
Min Operating Temperature
0°C
Number of Cores
1
Operating Supply Voltage
3.3V
Package Quantity
500
Packaging
Tape and Reel
Radiation Hardening
No
RAM Size
8KB
RoHS Compliant
No
Series
MPC8xx
Weight
0.060814oz
Compliance
RoHS
Not CompliantNo
Datasheet
NXP MPC850DEZQ66BUR2 Datasheet
Download the complete datasheet for NXP MPC850DEZQ66BUR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.