32-bit RISC microprocessor featuring a dual-core e500 device core operating at up to 1.5GHz. This PowerQUICC III MPC85xx processor utilizes a 0.09um process technology and offers 32KB instruction and 32KB data cache. The 1023-pin FCBGA package, measuring 33x33mm with a 1mm pitch, supports surface mounting. Key interfaces include I2C and UART, with one I2C and two UART controllers. Operating voltage ranges from 1.8V to 3.3V, with a maximum operating supply voltage of 1.155V, and a temperature range of -40°C to 105°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
NXP MPC8572ECVTAVND technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
1023
PCB
1023
Package Length (mm)
33
Package Width (mm)
33
Package Height (mm)
2.78(Max)
Seated Plane Height (mm)
3.38(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
PowerQUICC III MPC85xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
e500
Maximum Speed
1500MHz
Process Technology
0.09um
Number of CPU Cores
2
Interface Type
I2C/UART
CAN
0
UART
2
USART
0
I2C
1
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.155V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Ethernet Speed
10Mbps/100Mbps/1000Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC8572ECVTAVND Datasheet
Download the complete datasheet for NXP MPC8572ECVTAVND to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.