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Technical Specifications
NXP MPC857TZQ66B technical specifications.
General
Package/Case
BGA
Data Bus Width
32b
Frequency
66MHz
Halogen Free
Halogen Free
Lead Free
Contains Lead
Max Frequency
66MHz
Max Operating Temperature
105°C
Min Operating Temperature
0°C
Max Supply Voltage
3.3V
Min Supply Voltage
2V
Mount
Surface Mount
Number of Cores
1
Package Quantity
44
Packaging
Tray
Radiation Hardening
No
RAM Size
8KB
RoHS Compliant
No
Series
MPC8xx
Weight
0.076675oz
Compliance
RoHS
Not CompliantNo
Datasheet
NXP MPC857TZQ66B Datasheet
Download the complete datasheet for NXP MPC857TZQ66B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.