
32-bit RISC microprocessor, part of the PowerQUICC MPC8xx Processor family, operating at a maximum speed of 50 MHz. Features a 0.32um process technology and a single CPU core. Includes 4KB instruction cache and 4KB data cache. Interface options include I2C, SPI, and UART. Packaged in a 357-pin BGA (Ball Grid Array) with a 1.27mm pin pitch, suitable for surface mounting.
NXP MPC860ENZQ50D4 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 357 |
| PCB | 357 |
| Package Length (mm) | 25 |
| Package Width (mm) | 25 |
| Package Height (mm) | 1.82(Max) |
| Seated Plane Height (mm) | 2.52(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 2.1737 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034BAK-1 |
| Family Name | PowerQUICC MPC8xx Processor |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | MPC8xx |
| Maximum Speed | 50MHz |
| Process Technology | 0.32um |
| Number of CPU Cores | 1 |
| Interface Type | I2C/SPI/UART |
| CAN | 0 |
| UART | 1 |
| USART | 0 |
| I2C | 1 |
| SPI | 1 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 3.465|3.6V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 95°C |
| Instruction Cache Size | 4KB |
| Data Cache Size | 4KB |
| Multiply Accumulate | No |
| Ethernet Interface Type | MII |
| Ethernet Speed | 10Mbps/100Mbps |
| Cage Code | H1R01 |
| EU RoHS | No |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP MPC860ENZQ50D4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.