32-bit RISC microprocessor, part of the PowerQUICC MPC8xx Processor family, operating at a maximum speed of 50 MHz. Features a 0.32um process technology and a single CPU core. Includes 4KB instruction cache and 4KB data cache. Interface options include I2C, SPI, and UART. Packaged in a 357-pin BGA (Ball Grid Array) with a 1.27mm pin pitch, suitable for surface mounting.
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MPC860ENZQ50D4 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
357
PCB
357
Package Length (mm)
25
Package Width (mm)
25
Package Height (mm)
1.82(Max)
Seated Plane Height (mm)
2.52(Max)
Pin Pitch (mm)
1.27
Package Weight (g)
2.1737
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034BAK-1
Family Name
PowerQUICC MPC8xx Processor
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
MPC8xx
Maximum Speed
50MHz
Process Technology
0.32um
Number of CPU Cores
1
Interface Type
I2C/SPI/UART
CAN
0
UART
1
USART
0
I2C
1
SPI
1
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
3.465|3.6V
Min Operating Temperature
0°C
Max Operating Temperature
95°C
Instruction Cache Size
4KB
Data Cache Size
4KB
Multiply Accumulate
No
Ethernet Interface Type
MII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MPC860ENZQ50D4 Datasheet
Download the complete datasheet for NXP MPC860ENZQ50D4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.