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Technical Specifications
NXP MPC860SRZP50 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
357
PCB
357
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MPC860SRZP50 Datasheet
Download the complete datasheet for NXP MPC860SRZP50 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.