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Technical Specifications
NXP MSCMMX6DZDK08AB technical specifications.
General
| Max Operating Temperature | 85 |
| Number of Terminals | 500 |
| Min Operating Temperature | 0 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | R-PBGA-B500 |
| Width | 14 |
| Length | 17 |
| Temperature Grade | OTHER |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| External Data Bus Width | 0 |
| Address Bus Width | 0 |
| Speed | 800 |
Compliance
| RoHS | Yes |
| HTS Code | 8542.31.00.01 |
| REACH | Compliant |
| Military Spec | False |
Datasheet
NXP MSCMMX6DZDK08AB Datasheet
Download the complete datasheet for NXP MSCMMX6DZDK08AB to view detailed technical specifications.
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