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Technical Specifications
NXP N74F827N,602 technical specifications.
General
Package/Case
DIP
High Level Output Current
64mA
Logic Function
Buffer, Inverting
Low Level Output Current
24mA
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Mount
Through Hole
Number of Bits per Element
10
Number of Elements
1
Package Quantity
15
Packaging
Rail/Tube
RoHS Compliant
No
Series
74F
Compliance
RoHS
Not Compliant
Datasheet
NXP N74F827N,602 Datasheet
Download the complete datasheet for NXP N74F827N,602 to view detailed technical specifications.
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