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Technical Specifications
NXP NE570F technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | CDIP |
| Package Description | Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 19.94(Max) |
| Package Width (mm) | 7.77(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Ceramic |
| Mounting | Through Hole |
Compliance
| Cage Code | H1R01 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
NXP NE570F Datasheet
Download the complete datasheet for NXP NE570F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.