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Technical Specifications
NXP NTBA104BQ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
DHVQFN EP
Package Description
Depopulated Heat Sink Very Thin Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
14
PCB
14
Package Length (mm)
3.1(Max)
Package Width (mm)
2.6(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-241
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP NTBA104BQ Datasheet
Download the complete datasheet for NXP NTBA104BQ to view detailed technical specifications.
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