Single DPDT analog switch, surface mount, XQFN package (1.8mm x 1.4mm x 0.45mm max) with 10 pins and 0.4mm pitch. Features non-inverting polarity, DPDT switch architecture, and a maximum on-resistance range of 10 to 25 Ohms. Operates across a temperature range of -40°C to 125°C.
PackageXQFN
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
NXP NX3DV42GU,115 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
XQFN
Lead Shape
No Lead
Pin Count
10
PCB
10
Package Length (mm)
1.8
Package Width (mm)
1.4
Package Height (mm)
0.45(Max)
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-288X1DDE
Type
Analog Switch
Configuration
Single DPDT
Number of Channels per Chip
1
Switch Architecture
DPDT
Number of Inputs per Chip
2
Number of Outputs per Chip
4
Polarity
Non-Inverting
Maximum On Resistance Range
10 to 25Ohm
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP NX3DV42GU,115 Datasheet
Download the complete datasheet for NXP NX3DV42GU,115 to view detailed technical specifications.
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