Dual SPST analog switch, featuring 2 channels per chip, housed in an 8-pin XSON package. This surface-mount component offers a non-inverting switch architecture with a maximum on-resistance range of 1 to 5 Ohms. The plastic, leadless XSON package measures a maximum of 2mm in length, 1.05mm in width, and 0.46mm in height, with a seated plane height of 0.5mm. Operating across a temperature range of -40°C to 125°C, it utilizes a non-lead-frame SMT basic package type.
PackageXSON
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
NXP NX3L2T384GT technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
XSON
Package Description
Plastic Extremely Thin Small Outline Package No Lead
Lead Shape
No Lead
Pin Count
8
PCB
8
Package Length (mm)
2(Max)
Package Width (mm)
1.05(Max)
Package Height (mm)
0.46(Max)
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.5|0.6
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-252
Type
Analog Switch
Configuration
Dual SPST
Number of Channels per Chip
2
Switch Architecture
SPST
Number of Inputs per Chip
2
Number of Outputs per Chip
2
Polarity
Non-Inverting
Maximum On Resistance Range
1 to 5Ohm
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP NX3L2T384GT Datasheet
Download the complete datasheet for NXP NX3L2T384GT to view detailed technical specifications.
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