PackageWLCSP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP NX3P191UK,023 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
4
PCB
4
Package Length (mm)
0.76
Package Width (mm)
0.76
Package Height (mm)
0.31
Seated Plane Height (mm)
0.51
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Type
High Side
Number of Outputs
1
Switch On Resistance
0.15Ohm
Maximum Input Voltage
3.6V
Maximum Power Dissipation
300mW
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Operating Supply Voltage Range
1.1 to 3.6V
Minimum Input Voltage
1.1V
Compliance
Cage Code
H1R01
EU RoHS
Yes
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP NX3P191UK,023 Datasheet
Download the complete datasheet for NXP NX3P191UK,023 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.