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Technical Specifications
NXP NX3P191UK,023 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 0.76 |
| Package Width (mm) | 0.76 |
| Package Height (mm) | 0.31 |
| Seated Plane Height (mm) | 0.51 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | High Side |
| Number of Outputs | 1 |
| Switch On Resistance | 0.15Ohm |
| Maximum Input Voltage | 3.6V |
| Maximum Power Dissipation | 300mW |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Operating Supply Voltage Range | 1.1 to 3.6V |
| Minimum Input Voltage | 1.1V |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP NX3P191UK,023 Datasheet
Download the complete datasheet for NXP NX3P191UK,023 to view detailed technical specifications.
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