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Technical Specifications
NXP P1011NXE2DFB technical specifications.
General
Package/Case
LBGA
Core Architecture
RISC
Data Bus Width
32b
Halogen Free
Halogen Free
Max Operating Temperature
125°C
Memory Size
32KB
Memory Type
Cache,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
16
Number of Programmable I/O
16
Packaging
Tray
RoHS Compliant
Yes
Series
MPC83xx
Voltage
1.2V
Weight
0.18509oz
Compliance
RoHS
Compliant
Datasheet
NXP P1011NXE2DFB Datasheet
Download the complete datasheet for NXP P1011NXE2DFB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.