Dual-core 32-bit RISC microprocessor operating at 533 MHz, built on 45nm process technology. Features e500 core architecture with a 689-pin TEBGA II package for surface mounting. Offers multiple interface types including Ethernet (MII/RMII/RGMII/SGMII) supporting 10/100/1000Mbps speeds, I2C, SPI, and USB. Operates within a temperature range of -40°C to 105°C.
PackageTEBGA II
MountingSurface Mount
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Technical Specifications
NXP P1020NXE2DFB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TEBGA II |
| Lead Shape | Ball |
| Pin Count | 689 |
| PCB | 689 |
| Package Length (mm) | 31 |
| Package Width (mm) | 31 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.46(Max) |
| Pin Pitch (mm) | 1 |
| Package Weight (g) | 4.7431 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BFB |
| Family Name | QorIQ P1020 |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | e500 |
| Maximum Speed | 533MHz |
| Process Technology | 45nm |
| Core Architecture | e500 |
| Number of CPU Cores | 2 |
| Interface Type | Ethernet/I2C/SPI/USB |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 2 |
| SPI | 1 |
| USB | 1 |
| Ethernet | 3 |
| I2S | 0 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| Multiply Accumulate | No |
| Ethernet Interface Type | MII/RMII/RGMII/SGMII |
| Ethernet Speed | 10Mbps/100Mbps/1000Mbps |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP P1020NXE2DFB Datasheet
Download the complete datasheet for NXP P1020NXE2DFB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.