8-bit CISC microcontroller featuring an 80C51 core, operating at up to 18 MHz. This surface-mount device offers 2KB of Flash program memory and 256 bytes of RAM. It includes 14 programmable I/Os, two timers, and I2C/UART interfaces. The 16-pin TSSOP package is designed for lead-frame SMT mounting with a 0.65mm pin pitch. Supports 2.5V/3.3V operation with a maximum supply voltage of 3.6V, and operates within a temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP P89LPC9171FDH technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AB |
| Family Name | P89 |
| Data Bus Width | 8bit |
| Instruction Set Architecture | CISC |
| Maximum Clock Rate | 18MHz |
| Maximum CPU Frequency | 18MHz |
| Device Core | 80C51 |
| Program Memory Type | Flash |
| Program Memory Size | 2KB |
| RAM Size | 256B |
| Number of Programmable I/Os | 14 |
| Core Architecture | 8051 |
| Programmability | Yes |
| Number of Timers | 2 |
| Interface Type | I2C/UART |
| CAN | 0 |
| I2C | 1 |
| SPI | 0 |
| Ethernet | 0 |
| UART | 1 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| ADC Channels | 4 |
| Number of ADCs | Single |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP P89LPC9171FDH Datasheet
Download the complete datasheet for NXP P89LPC9171FDH to view detailed technical specifications.
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