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Technical Specifications
NXP P89LPC931A1FDH,512 technical specifications.
General
Package/Case
TSSOP
Core Architecture
80C51
Data Bus Width
8b
Interface
I2C, SPI, UART, USART
Max Frequency
18MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
1.5W
Max Supply Voltage
3.6V
Memory Size
8KB
Memory Type
FLASH,
Min Supply Voltage
2.4V
Number of I/Os
26
Number of Programmable I/O
23
Number of Timers/Counters
3
Oscillator Type
Internal
Package Quantity
51
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Radiation Hardening
No
RAM Size
256B
RoHS Compliant
Yes
Series
LPC900
Compliance
RoHS
Compliant
Datasheet
NXP P89LPC931A1FDH,512 Datasheet
Download the complete datasheet for NXP P89LPC931A1FDH,512 to view detailed technical specifications.
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